From Sand to Superintelligence · Drill cards · Chapter 13
Drills
The Vera Rubin Superchip
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| Front | Back |
|---|---|
| What three silicon tiles make up a Vera Rubin Superchip? | Two Rubin GPUs and one Vera CPU, all packaged together on a single substrate. |
| How many transistors does the Rubin GPU package total across both dies? | About 336 billion transistors. |
| What process node is the Rubin GPU fabricated on? | TSMC N3P. |
| How much HBM4 memory does the full Superchip carry? | 576 GB — 288 GB per GPU × two GPUs. |
| What is the FP4 compute performance of the full Superchip? | ~100 petaflops FP4. |
| What is NVLink-C2C’s bidirectional bandwidth? | 1.8 TB/s. |
| How does NVLink-C2C’s bandwidth compare to PCIe Gen6 x16? | Roughly seven times higher — PCIe Gen6 delivers about 256 GB/s total bidirectional (128 GB/s per direction). |
| What CPU architecture does the Vera CPU use? | NVIDIA’s Olympus Arm v9 architecture, with 88 cores. |
| How many components does a Vera Rubin Superchip contain? | Roughly seventeen thousand — about five times the part count of a smartphone. |
| What is the Vera CPU’s primary job in the Superchip? | Coordination: managing GPU memory, dispatching kernels, handling I/O, running the OS, and communicating with other Superchips through the rack network. |