What machine physically touches the die pads to run wafer-level tests?	A wafer prober, which uses a probe card studded with fine gold-plated tungsten or MEMS needles.
Roughly how many distinct tests does probe run on a complex chip like Rubin?	Hundreds or thousands of distinct tests.
What are 'scribe lines' on a wafer?	Channels in the silicon between dies along which the dicing saw or laser cuts to singulate the individual chips.
What is 'yield' in wafer manufacturing?	The fraction of working dies on a finished wafer.
What is a typical yield range for leading-edge logic at the start of production?	50–80% is typical; early in production, even 50% would not be surprising for a reticle-limit die like Rubin.
How much does a 300 mm Rubin wafer cost to produce, approximately?	Perhaps $20,000.
What is the approximate cost per known-good Rubin die?	Around $10,000.
What happens to a die that fails one functional block but passes otherwise?	It may be binned and sold as a lower-tier product with that block disabled — a recoverable failure rather than a discard.
What is a 'performance bin' in wafer test?	A category assigned to a passing die based on its maximum reliable clock speed and functional completeness.
What comes after dicing for a Rubin GPU die, making it only 'halfway' to finished?	Advanced packaging — integrating the GPU die with stacks of high-bandwidth memory on a silicon interposer.